Le tele o ituaiga o substrates faʻaaogaina mo PCBs, ae lautele vaevaeina i ni vaega se lua, e taʻua o mea faʻapipiʻi meaʻai ma mea faʻapipiʻi meaola.
Mea fa'amea fa'akomepiuta
O mea faʻapitoa e masani lava o ipu sima, o mea faʻapipiʻi eletise eletise o le 96% alumina, i le tulaga e manaʻomia ai se malosi maualuga, 99% mea alumina mama e mafai ona faʻaaogaina ae maualuga le mama alumina faʻafitauli faigata, o le fua o le fua e maualalo, o lea o le e maualuga le fa'aaogaina o le alumina mama.Beryllium oxide o le mea foi lea o le sima substrate, o le u'amea u'amea, o lo'o i ai mea fa'apipi'i eletise lelei ma lelei lelei le fa'aogaina o le vevela, e mafai ona fa'aaoga e fai ma sui mo ta'aloga maualuga maualuga.
E masani ona fa'aogaina mea'ai sima i totonu o le mafiafia ma manifinifi ata tifaga feso'ota'iga feso'ota'iga, tele-chip micro-assembly circuits, o lo'o i ai le lelei e le mafai ona fa'atusalia mea fa'aola.Mo se faʻataʻitaʻiga, o le CTE o le mea faʻapipiʻi sima e mafai ona fetaui ma le CTE o le fale LCCC, o lea o le a maua ai le faʻalagolago faʻatasi lelei pe a faʻapipiʻi masini LCCC.E le gata i lea, o mea'ai sima e talafeagai mo le fa'agasologa o le vacuum evaporation i le gaosiga o chip aua latou te le fa'auluina se aofa'i tele o kasa adsorbed e mafua ai le fa'aitiitia o le vacuum level e tusa lava pe vevela.E le gata i lea, o substrate sima e maualuga foi le vevela o le vevela, lelei le maeʻa, maualuga kemisi mautu, o le mea e sili ona fiafia i ai mo le mafiafia ma manifinifi afi eletise ma le tele-chip micro-assembly circuits.Ae ui i lea, e faigata ona faʻagasolo i totonu o se substrate tele ma mafolafola, ma e le mafai ona faia i totonu o se fausaga laupapa faʻapipiʻi tuʻufaʻatasia e faʻafetaui ai manaʻoga o le gaosiga otometi E le gata i lea, ona o le tele o le dielectric tumau o mea sima, o lea e e le talafeagai foi mo substrates matagaluega maualuga-saosaoa, ma le tau e fai si maualuga.
Mea fa'ameamea fa'aletino
O mea faʻapipiʻi faʻaletino o loʻo faia i mea faʻamalosia e pei o le ie tioata (pepa fibre, fala tioata, ma isi), faʻapipiʻiina i le resini fusi, faʻagogo i se avanoa, ona ufiufi lea i le pepa kopa, ma faia i le maualuga o le vevela ma le mamafa.O lenei ituaiga o substrate ua taʻua o le laminate copper-clad laminate (CCL), e masani ona taʻua o panels apamemea, o le mea autu mo le gaosiga o PCBs.
CCL le tele o ituaiga, pe afai o le mea faʻamalosia e faʻaaogaina e vaevae ai, e mafai ona vaevaeina i luga o pepa, faʻapipiʻi ie tioata, faʻavae tuʻufaʻatasia (CEM) ma faʻavae uʻamea faʻavae;e tusa ai ma le fusifusi resin organic faaaogaina e vaevaeina, ma e mafai ona vaevaeina i phenolic resin (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) ma polyphenylene eter resin (PPO);pe afai o le substrate e malo ma fetuutuunai e vaevae, ma e mafai ona vaevaeina i CCL malo ma fetuutuunai CCL.
I le taimi nei o loʻo faʻaaogaina lautele i le gaosiga o le PCB lua itu o le epoxy glass fiber circuit substrate, lea e tuʻufaʻatasia ai le lelei o le malosi lelei o le alava tioata ma le epoxy resin toughness, ma le malosi lelei ma le ductility.
Epoxy glass fiber circuit substrate e faia e ala i le muamua infiltrating resin epoxy i le ie alava tioata e fai ai le laminate.I le taimi lava e tasi, e faʻaopoopoina isi vailaʻau, e pei o vailaʻau faʻamalolo, stabilizers, anti-flammability agents, adhesives, ma isi. laminate.E mafai ona faʻaaogaina e fai ai PCBs tasi-itu, lua-itu ma multilayer.
Taimi meli: Mati-04-2022