O a mea lelei ma le le lelei o le BGA Packaged?

I. BGA afifiina o le faagasologa afifiina ma manaoga uelo maualuga i le gaosiga PCB.O ona fa'amanuiaga e fa'apea:
1. Puupuu pine, maualalo le maualuga o le faʻapotopotoga, laʻititi parasitic inductance ma le capacitance, lelei le faatinoga o le eletise.
2. Tuʻufaʻatasiga maualuga tele, tele pine, vaʻaiga pine tele, pine coplanar lelei.Ole tapula'a ole va ole pine ole eletise ole QFP ole 0.3mm.Pe a faʻapipiʻiina le laupapa faʻasalalau faʻapipiʻi, o le faʻapipiʻiina o le saʻo o le QFP chip e matua faʻamaoni.O le faʻamaoni o le fesoʻotaʻiga eletise e manaʻomia ai le faʻapipiʻiina o le faapalepale e 0.08mm.O pine eletise QFP ma vaapiapi vaapiapi e manifinifi ma maaleale, faigofie ona mimilo pe malepe, lea e manaʻomia ai le tutusa ma le vaʻaia i le va o pine laupapa matagaluega e tatau ona faʻamaonia.I se faʻatusatusaga, o le sili ona lelei o le BGA afifi o le 10-electrode pine spacing e tele, o le va masani masani o le 1.0mm.1.27mm, 1.5mm (Inisi 40mil, 50mil, 60mil), o le faʻapipiʻiina o le faapalepale o le 0.3mm, ma le tele masani. -faigaluegamasini SMTmatoe tafe le ogaumue mafai ona fa'amalieina mana'oga o le BGA fa'apotopotoga.

II.E ui o le BGA encapsulation o loʻo i ai tulaga lelei o loʻo i luga, e iai foʻi faʻafitauli nei.O mea nei e le lelei o le BGA encapsulation:
1. E faigata ona asiasia ma tausia BGA pe a uma uelo.E tatau i le au gaosi PCB ona faʻaogaina le X-ray fluoroscopy poʻo le X-ray layering inspection e faʻamautinoa ai le faʻamaoni o le fesoʻotaʻiga uelo laupapa, ma e maualuga le tau o meafaigaluega.
2. Solder solder taʻitoʻatasi o le laupapa matagaluega ua motusia, o lea e tatau ona aveese le vaega atoa, ma le aveesea BGA e le mafai ona toe faaaogaina.