BGA soldering station folasaga
BGA nofoaga fa'amauinae masani foi ona taʻua BGA rework station, o se meafaigaluega faapitoa e faʻaaogaina i tupe meataalo BGA ma faafitauli soldering poʻo le taimi e manaʻomia ai ona sui tupe meataalo BGA fou.Talu ai o le vevela manaʻomia o le BGA chip uelo e fai si maualuga, o lea e le mafai e le meafaigaluega faʻavevela lautele ona ausia ona manaʻoga.
BGA solder laulau o loʻo galue ma le tulaga masanitoe tafe le ogaumucurve, o lea e matua aoga tele e fai BGA rework, ma le fua faatatau manuia e mafai ona oo atu i le sili atu i le 98% pe afai e faia i se laulau soldering BGA sili atu.
Fa'avasegaina ole laulau toe fa'aleleia BGA
1. Fa'ata'ita'iga tusilima
A tuu BGA i luga o le PCB, e faalagolago i luga o le poto masani o le tagata faagaoioia e faapipii ai e tusa ai ma le faavaa lomitusi lau i luga o le PCB, lea e talafeagai mo BGA chip reworking ma tele BGA solder polo pitch (luga 0.6).Se'i vagana ai le fua o le vevela pe a otometi le fa'avevela, o isi gaioiga uma e mana'omia le fa'aogaina o le tusi.
2. Fa'ata'ita'iga Semi-autometi
BGA tin ball pitch e la'ititi tele (0.15-0.6) BGA chips e alu ma le lima i le patch o le a iai ni mea sese ma faigofie ona mafua ai le leaga o le uelo.Optical alignment mataupu faavae o le faʻaaogaina o le spectroscopic prism imaging system e faʻalautele le BGA solder solder ma PCB pads, ina ia faʻapipiʻi a latou ata faʻalautele pe a maeʻa paʻu i luga, lea o le a aloese mai mea sese e tupu i le patching.O le fa'avevela faiga o le a tamo'e aunoa pe a mae'a le patching, ma o le ai ai se fa'ailo fa'ailo vave pe a uma le uelo.
3. Fa'ata'ita'iga otometi
E pei ona taʻu mai e le igoa, o lenei faʻataʻitaʻiga o se faiga toe faʻaleleia atoatoa, lea e faʻavae i luga o le faʻaogaina o le vaʻaia o masini o lenei auala faʻatekonolosi maualuga e ausia ai le faʻagasologa otometi atoatoa.
NeoDen BGA Rework nofoaga
Malosiaga: AC220V±10%, 50/60HZ
Malosiaga: 5.65KW(Max), Fa'avevela pito i luga (1.45KW)
Fa'avevela pito i lalo (1.2KW), IR Preheater (2.7KW), Isi(0.3KW)
Tele PCB: 412*370mm(Max);6*6mm(Min)
BGA Chip Tele: 60*60mm(Max);2*2mm(Min)
IR Heater Tele: 285*375mm
Temperature Sensor: 1 pcs
Auala Fa'atino: 7″ HD mata pa'i
Faiga Pulea: Pulea fa'avevela tuto'atasi V2(komipiuta puletaofia)
Fa'aaliga Fa'aaliga: 15″ SD fa'aaliga fale gaosimea (720P mata luma)
Faiga Fa'atulagaina: 2 Miliona Pixel SD faiga fa'akomepiuta fa'akomepiuta, fa'asolo mata fa'amasani fa'atasi ma le laser: fa'ailoga lanu mumu
Vacuum Adsorption: Otometi
Fa'atonu Sa'o: ±0.02mm
Pulea o le vevela: K-ituaiga thermocouple tapuni tapuni tapuni ma sao atoatoa e oo atu i le ±3 ℃
Mea Fafaga: Leai
Tulaga: V-groove ma mea faʻapipiʻi lautele
Fua: L685 * W633 * H850mm
Mamafa: 76KG
Taimi meli: Tes-24-2021