O le a le mea e fai e le BGA Repair Machine?

BGA soldering station folasaga

BGA nofoaga fa'amauinae masani foi ona taʻua BGA rework station, o se meafaigaluega faapitoa e faʻaaogaina i tupe meataalo BGA ma faafitauli soldering poʻo le taimi e manaʻomia ai ona sui tupe meataalo BGA fou.Talu ai o le vevela manaʻomia o le BGA chip uelo e fai si maualuga, o lea e le mafai e le meafaigaluega faʻavevela lautele ona ausia ona manaʻoga.

BGA solder laulau o loʻo galue ma le tulaga masanitoe tafe le ogaumucurve, o lea e matua aoga tele e fai BGA rework, ma le fua faatatau manuia e mafai ona oo atu i le sili atu i le 98% pe afai e faia i se laulau soldering BGA sili atu.

 

Fa'avasegaina ole laulau toe fa'aleleia BGA

1. Fa'ata'ita'iga tusilima

A tuu BGA i luga o le PCB, e faalagolago i luga o le poto masani o le tagata faagaoioia e faapipii ai e tusa ai ma le faavaa lomitusi lau i luga o le PCB, lea e talafeagai mo BGA chip reworking ma tele BGA solder polo pitch (luga 0.6).Se'i vagana ai le fua o le vevela pe a otometi le fa'avevela, o isi gaioiga uma e mana'omia le fa'aogaina o le tusi.

2. Fa'ata'ita'iga Semi-autometi

BGA tin ball pitch e la'ititi tele (0.15-0.6) BGA chips e alu ma le lima i le patch o le a iai ni mea sese ma faigofie ona mafua ai le leaga o le uelo.Optical alignment mataupu faavae o le faʻaaogaina o le spectroscopic prism imaging system e faʻalautele le BGA solder solder ma PCB pads, ina ia faʻapipiʻi a latou ata faʻalautele pe a maeʻa paʻu i luga, lea o le a aloese mai mea sese e tupu i le patching.O le fa'avevela faiga o le a tamo'e aunoa pe a mae'a le patching, ma o le ai ai se fa'ailo fa'ailo vave pe a uma le uelo.

3. Fa'ata'ita'iga otometi

E pei ona taʻu mai e le igoa, o lenei faʻataʻitaʻiga o se faiga toe faʻaleleia atoatoa, lea e faʻavae i luga o le faʻaogaina o le vaʻaia o masini o lenei auala faʻatekonolosi maualuga e ausia ai le faʻagasologa otometi atoatoa.

 

NeoDen BGA Rework nofoaga

Malosiaga: AC220V±10%, 50/60HZ

Malosiaga: 5.65KW(Max), Fa'avevela pito i luga (1.45KW)

Fa'avevela pito i lalo (1.2KW), IR Preheater (2.7KW), Isi(0.3KW)

Tele PCB: 412*370mm(Max);6*6mm(Min)

BGA Chip Tele: 60*60mm(Max);2*2mm(Min)

IR Heater Tele: 285*375mm

Temperature Sensor: 1 pcs

Auala Fa'atino: 7″ HD mata pa'i

Faiga Pulea: Pulea fa'avevela tuto'atasi V2(komipiuta puletaofia)

Fa'aaliga Fa'aaliga: 15″ SD fa'aaliga fale gaosimea (720P mata luma)

Faiga Fa'atulagaina: 2 Miliona Pixel SD faiga fa'akomepiuta fa'akomepiuta, fa'asolo mata fa'amasani fa'atasi ma le laser: fa'ailoga lanu mumu

Vacuum Adsorption: Otometi

Fa'atonu Sa'o: ±0.02mm

Pulea o le vevela: K-ituaiga thermocouple tapuni tapuni tapuni ma sao atoatoa e oo atu i le ±3 ℃

Mea Fafaga: Leai

Tulaga: V-groove ma mea faʻapipiʻi lautele

Fua: L685 * W633 * H850mm

Mamafa: 76KG

NeoDen SMT Gaosiga laina


Taimi meli: Tes-24-2021

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